SPT Microelectronics is built on a 50 year foundation of leading oxidation diffusion, LPCVD, and APCVD technologies. They offer customized cutting-edge thermal products that accelerate your success. Together with Japanese SPP Technologies, a subsidiary of Sumitomo Precision Products, they offer a wide range of thermal process equipment and different tools for etching and deposition.
SPT is a leading supplier of deep silicon etch (Bosch process) for micro-electromechanical systems and oxidation, diffusion, LPCVD and APCVD technologies for Semiconductor, Power, MEMS, III-V and packaging applications.
Vertical Batch Furnaces
AVP Ace
Newest release Advanced/Rapid Vertical Processor for 150mm and 200mm wafers
Superior process results
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Excellent temperature control from 100-1250C
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Advanced injector technology for optimal gas distribution
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Low O2 load lock maintains controlled wafer environment and ensures repeatability
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Uses qualified process module
Low cost of ownership
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Single or dual-boat configuration
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Modular architecture for fast move in and startup
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Dual-boat configuration eliminates wafer load/unload time
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In-situ clean capability reduces CoO by up to 50%
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Fast temperature ramp/cool option enables up to 30% reduction in process time
System flexibility
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Runs 2 wafer sizes simultaneously with no hardware changes
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Compatible with perforated, bonded and ultra-thin substrates
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Field conversion kits enable fast applications changes
RVP Ace
Newest release Rapid Vertical Processor for 200mm and 300mm wafers
Process Flexibility
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Runs 200 and 300 mm simultaneously with no hardware changes
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Compatible with bonded, thin and bowed substrates
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Advanced across-flow chamber design for enhanced process control
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Uses proven process modules
Low Cost of Ownership
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Modular architecture for fast move in and startup
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Improved automation reliability
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Minimum calibration and Preventive maintenance
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Dual-boat configuration eliminates wafer load/unload time
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In-situ clean capability reduces CoO by up to 50%
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Fast temperature ramp/cool option enables up to 30% reduction in process time
RVP-300
RVP-300plus and RVP-550 Rapid Vertical Processors for 200mm and 300mm wafers
Features:
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The RVP-300 Plus/550 is the industry’s production-proven 300mm furnace
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Superior productivity
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Full complement of APCVD and LPCVD process selections
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Designed to occupy minimal fab space
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Layout provides for multiple systems with zero side spacing required due to innovative packaging
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Excellent accessibility for maintenance from rear
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Enhanced Temperature Control
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Utilizes fast ramping element and forced air cooling
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Proprietary Advanced Temperature Control software to maximize throughput by minimizing the time to attain and cool from process temperature
AVP/RVP
AVP-8000, AVP-8200, RVP-9000, and RVP-9200 Vertical Processors for 150-200mm wafers
Features:
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Advanced/Rapid Vertical Process
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Small footprint enables side by side installation
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Low Cost of Ownership
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Single or Dual boat configuration
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Up to 200 wafer batch
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Remanufactured tools available (subject to donor availability)
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Flexible substrate handling
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150mm and or 200mm wafers
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Perforated and thin/bowed wafers
WJ-APCVD
Watkins Johnson (WJ) Atmospheric Pressure CVDs with self-cleaning, heated conveyor processing
SPT offers continued support, spares, and upgrades for Atmospheric Pressure CVD of SiH4 or TEOS based dielectrics. Our patented Watkins Johnson (WJ) linear injector technology enables precise, repeatable deposition of doped or un-doped films with no transient film properties and uniform gap fill across the wafer.
SILICON ETCHING
Predeus/Proxion Si Deep RIE
Mass-production silicon deep etching equipment
A mass-production silicon deep etching equipment for MEMS and semiconductor applications, established by adding proprietary technologies to the Bosch process.
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Achieving the world’s highest selectivity and etch rate while maintaining vertical etching profiles, sidewall roughness, and CD (critical dimension) loss.
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Realizing a wide range of etching profiles through a comprehensive process library.
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Applicable to semiconductor applications such as power MOSFETs and through-silicon vias (TSVs) on 200mm and 300mm wafers.
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Offering a range of transport systems from vacuum load-lock types to cluster types, suitable for both research and development as well as mass production.
300mm Si Deep RIE
High-volume production silicon deep etching equipment
System for high-volume production Si Deep RIE System for 300mm wafer, applications include:
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MEMS
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TSV
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LED
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RF
OTHER ETCHING
Spica/Sirius
Other material etching
Etching equipment for challenging materials (SiC, compound/oxide film), including compound semiconductors and optical devices.
Vetelgeuse
Sacrificial Layer Etching
SiO2 Sacrificial Layer Etching System with Fluoride (HF) and Ammonia (NH3) for MEMS industry, e.g., Accelerometer, Gyro sensor, Pressure sensor, Silicon microphone, Silicon resonator, Optical switch. Features:
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Capable of etching structures containing aluminum electrodes without corroding the aluminum
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Capable of microfabrication and long undercut in millimeter
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Capable of no waste liquid treatment, low frequency maintenance and high stability by Dry process
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Capable of R&D use and Mass Production use by wide Plat Form line up from simple manual type to cluster type
Deposition
Cetus
Oxide/nitride film deposition
SiO2/SiN PECVD plasma deposition equipment for forming low-stress silicon nitride films and thick silicon oxide films, applications include:
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MEMS
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TSV
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LED
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RF